ER2074
Thermally Conductive Epoxy Resin

ER2074
Thermally Conductive Epoxy Resin
ER2074 is a flame retardant system two component epoxy resin with UL94 V-0 approval with high thermal conductivity value of 1.26W/m.K.
ER2074
Thermally Conductive Epoxy Resin
ER2074
Thermally Conductive Epoxy Resin
ER2074 is a flame retardant system two component epoxy resin with UL94 V-0 approval with high thermal conductivity value of 1.26W/m.K.
ER2224
Thermally Conductive Epoxy Potting Compound
ER2224
Thermally Conductive Epoxy Potting Compound
ER2224 Epoxy potting compound is a highly thermally conductive resin (1.0 W/m*K) which also offers strong thermal cycling properties. It is an off-white resin allowing it to blend with LED designs, dissipating heat from the LED and extending the units operating lifetime and reliability.
ER2222
Red Thermally Conductive Epoxy Resin
ER2222
Red Thermally Conductive Epoxy Resin
ER2222 is a red variation of Electrolube's ER2221 Thermally conductive Epoxy potting compound. The resins properties are identical to ER2221 but has been formulated with a red finish for aesthetic appearance.
ER2221
Thermally Conductive Epoxy Potting Compound
ER2221
Thermally Conductive Epoxy Potting Compound
ER2221 resin has been formulated as high temperature resistant and thermally conductive potting compound which retains excellent characteristics throughout thermal cycling. ER2221 is coloured black.
ER2220
Highly Thermally Conductive Epoxy Potting Compound
ER2220
Highly Thermally Conductive Epoxy Potting Compound
ER2220 is a flame retardant, thermally conductive epoxy encapsulation resin which combines ease of processing with an enhanced thermal conductivity.
ER2183
Thermally Conductive Epoxy Potting Compound
ER2183
Thermally Conductive Epoxy Potting Compound
ER2183 is a thermally conductive epoxy resin meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission.
SC2001
Heat Cured Silicone Resin
SC2001
Heat Cured Silicone Resin
SC2001 is a two-part, general purpose potting and encapsulating compound designed for the protection for electronic devices. It has exceptional high temperature properties.
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