GF400 thermal gap filler is a two part, liquid silicone based thermally conductive material which cures at room temperature or can be accelerated using heat. It has exceptional thermal performance (4.0 W/m.K) and after curing GF400 forms a low modulus elastomer preventing the ‘pump-out phenomenon’.
As with all thermal interface materials, we would always encourage stringent testing before selecting a material for your application. For further information please refer to the product TDS, or get in touch with our Technical Support Team who are always on hand to ‘Talk Solutions’
- Soft and compliant for low stress applications
- Low viscosity; easy to dispense
- High thermal conductivity
- Low modulus elastomer, prevents 'pump-out'