SC4003FD Fast Room Temperature Cure

Product Description

SC4003FD is a fast cure variant of SC4003 thixotropic silicone potting and encapsulating resin which has been specially designed for the Indian market. As with SC4003, SC4003FD is suitable for a wide range of electronic applications where there are difficult geometries to pot due to its thixotropic nature. It has similar characteristics with a wide operating temperature range and good high temperature performance with the only difference being a slightly lower thermal conductivity value than SC4003.

Key properties

Flexible Silicone Resin
Excellent Moisture resistance
Thixotropic with good flow characteristics
Room temperature cure, no ovens required
Wide temperature range (-60°C to +200°C)
Good thermal conductivity(0.9 W/m.K)
Simple 1:1 mix ratio,
Excellent adhesion to a wide range of substrates
Black Silicone Resin
RoHS Compliant

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