Compare Thermal Management Solutions Products
| 
																
																 GF400 Thermal Gap Filler  
								 | 
							
																
																 | 
							
																
																 GF400 Thermal Gap Filler  
								 | 
							
																
																 GF400 Thermal Gap Filler  
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						|
|---|---|---|---|---|
| 
									Type									 | 
							||||
| Silicone | 
																			 | 
								|||
| Non-silicone | ||||
| 
									Cure / Bonding									 | 
							||||
| Yes | 
																			 | 
								|||
| No | ||||
| 
									Interface / Gap Filling / Encapsulation									 | 
							||||
| Interface | ||||
| Gap filling | 
																			 | 
								|||
| Encapsulation | ||||
| 
									Viscosity (Pa.s)									 | 
							||||
| Viscosity Max | 170 | |||
| Viscosity Min | 170 | |||
| 
									Thermal Conductivity (W/m.K)									 | 
							||||
| Thermal Conductivity (W/m.K) | 4.00 | |||
| 
									Temperature (°C)									 | 
							||||
| Min Temperature | -50 | |||
| Max Temperature | 200 | |||
| 
									Electrically insulating									 | 
							||||
| Yes | 
																			 | 
								|||
| No | ||||
| 
									Density (g/mL)									 | 
							||||
| Density (g/mL) | 3.20 | |||
| 
									Flame retardency									 | 
							||||
| Yes | 
																			 | 
								|||
| No | ||||
| 
									Application method									 | 
							||||
| Screen printing | ||||
| Auto/Manual Dispensing | 
																			 | 
								|||
| Gap pad | ||||