Compare Thermal Management Solutions Products

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GP300

Thermal Gap Pad

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GP300

Thermal Gap Pad

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GP300

Thermal Gap Pad

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Type Cheveron Icon
Silicone Tick Icon
Non-silicone
Cure / Bonding Cheveron Icon
Yes
No Tick Icon
Interface / Gap Filling / Encapsulation Cheveron Icon
Interface Tick Icon
Gap filling
Encapsulation
Viscosity (Pa.s) Cheveron Icon
Viscosity Max
Viscosity Min
Thermal Conductivity (W/m.K) Cheveron Icon
Thermal Conductivity (W/m.K) 3.00
Temperature (°C) Cheveron Icon
Min Temperature -50
Max Temperature 160
Electrically insulating Cheveron Icon
Yes Tick Icon
No
Density (g/mL) Cheveron Icon
Density (g/mL) 3.00
Flame retardency Cheveron Icon
Yes
No Tick Icon
Application method Cheveron Icon
Screen printing
Auto/Manual Dispensing
Gap pad Tick Icon

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