Compare Thermal Management Solutions Products
TPM550 Thermal Interface Phase Change Material 
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TPM550 Thermal Interface Phase Change Material
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TPM550 Thermal Interface Phase Change Material
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Type
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| Silicone | ||||
| Non-silicone |
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Cure / Bonding
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| Yes | ||||
| No |
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Interface / Gap Filling / Encapsulation
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| Interface |
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| Gap Filling | ||||
| Encapsulation | ||||
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Viscosity (Pa.s)
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| Viscosity Max | ||||
| Viscosity Min | ||||
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Thermal Conductivity (W/m.K)
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| Thermal Conductivity (W/m.K) | 5.50 | |||
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Temperature (°C)
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| Min Temperature | -40 | |||
| Max Temperature | 125 | |||
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Electrically Insulating
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| Yes |
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| No | ||||
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Density (g/mL)
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| Density (g/mL) | 2.48 | |||
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Flame retardency
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| Yes | ||||
| No |
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Application method
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| Screen Printing |
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| Auto / Manual Dispensing | ||||
| Gap Pad | ||||
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