Compare Thermal Management Solutions Products
GF400 Thermal Gap Filler |
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GF400 Thermal Gap Filler |
GF400 Thermal Gap Filler |
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Type | ||||
Silicone | ||||
Non-silicone | ||||
Cure / Bonding | ||||
Yes | ||||
No | ||||
Interface / Gap Filling / Encapsulation | ||||
Interface | ||||
Gap filling | ||||
Encapsulation | ||||
Viscosity (Pa.s) | ||||
Viscosity Max | 170 | |||
Viscosity Min | 170 | |||
Thermal Conductivity (W/m.K) | ||||
Thermal Conductivity (W/m.K) | 4.00 | |||
Temperature (°C) | ||||
Min Temperature | -50 | |||
Max Temperature | 200 | |||
Electrically insulating | ||||
Yes | ||||
No | ||||
Density (g/mL) | ||||
Density (g/mL) | 3.20 | |||
Flame retardency | ||||
Yes | ||||
No | ||||
Application method | ||||
Screen printing | ||||
Auto/Manual Dispensing | ||||
Gap pad | ||||