GP300
Thermal Gap Pad
GP300
Thermal Gap Pad
GP300 is a silicone based thermal interface gap pad designed for easy application and good thermal conductivity.
HTCPX
Thermal Gap Filler
HTCPX
Thermal Gap Filler
HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.
HTCX
Non-Silicone Thermal Interface Material
HTCX
Non-Silicone Thermal Interface Material
Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower evaporation weight loss.
HTCX_ZF
Non-Silicone Thermal Interface Material
HTCX_ZF
Non-Silicone Thermal Interface Material
HTCX_ZF is a Zinc Oxide free version of Electrolube's highly successful Heat Transfer Compound Xtra (HTCX).
SC2001
Heat Cured Silicone Resin
SC2001
Heat Cured Silicone Resin
SC2001 is a two-part, general purpose potting and encapsulating compound designed for the protection for electronic devices. It has exceptional high temperature properties.
HTS
Silicone Heat Transfer Compound
HTS
Silicone Heat Transfer Compound
Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive compound which will operate over a wide temperature range.
HTC
Non-Silicone Thermal Interface Material
HTC
Non-Silicone Thermal Interface Material
Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required.
HTCP
Non-Silicone Heat Transfer Compound Plus
HTCP
Non-Silicone Heat Transfer Compound Plus
HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.