ER2074

Thermally Conductive Epoxy Resin

ER2074 is a flame retardant system two component epoxy resin with UL94 V-0 approval with high thermal conductivity value of 1.26W/m.K.

ER2221

Thermally Conductive Epoxy Potting Compound

ER2221 resin has been formulated as high temperature resistant and thermally conductive potting compound which retains excellent characteristics throughout thermal cycling. ER2221 is coloured black.

ER2220

Highly Thermally Conductive Epoxy Potting Compound

ER2220 is a flame retardant, thermally conductive epoxy encapsulation resin which combines ease of processing with an enhanced thermal conductivity.

ER2183

Thermally Conductive Epoxy Potting Compound

ER2183 is a thermally conductive epoxy resin meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission.

GF400

Thermal Gap Filler

GF400 is a two part, liquid silicone based gap filler, which provides excellent thermal performance.

GF400

Thermal Gap Filler

GF400 is a two part, liquid silicone based gap filler, which provides excellent thermal performance.

HTSX

Silicone Heat Transfer Compound Xtra

HTSX is a silicone thermal interface material which has been developed to perform in more extreme conditions than its sister product HTS.

TBS

Thermal Bonding System

Thermal Bonding System is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating.

TCRGUN

Cartridge Application Gun

Electrolube cartridge application gun, suitable for TCOR and TCER.

TCOR

RTV Thermally Conductive Oxime

TCOR Thermally Conductive Oxime is a single component, high thermal conductivity RTV for the effective bonding or gap filling in electronic devices.

HTSP

Silicone Heat Transfer Compound Plus

HTSP provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils.

HTCP

Non-Silicone Heat Transfer Compound Plus

HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.