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SC4008

RTV-2 Silicone Resin

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SC4008

RTV-2 Silicone Resin

SC4008 is a two-part low odor RTV-2 silicone potting which has been developed for the Indian electronics market.

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GF600

Thermally Conductive Gap Filler

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GF600

Thermally Conductive Gap Filler

High performance thermal gap filler ideal for applications such as EV batteries

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SC4010

Low Viscosity Silicone

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SC4010

Low Viscosity Silicone

SC4010 is a very low viscosity silicone potting and encapsulation compound for the protection of electronic components.  

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SC4004FD

Fast Cure Thixotropic Silicone Resin

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SC4004FD

Fast Cure Thixotropic Silicone Resin

SC4004FD is a fast curing variant of the thixotropic silicone potting compound SC4004. It shares many of the same characteristics as SC4003 but with accelerated cure time.

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SC4004

Thixotropic Silicone Resin

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SC4004

Thixotropic Silicone Resin

SC4004 is a thixotropic silicone potting compound which has been developed for the Indian electronics market.

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SC4003FD

Fast Room Temperature Cure Silicone

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SC4003FD

Fast Room Temperature Cure Silicone

SC4003FD is a fast cure variant of SC4003 thixotropic silicone potting and encapsulating resin which has been specially designed for the Indian market.

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SC4003

Room Temperature Cure Silicone

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SC4003

Room Temperature Cure Silicone

SC4003 is a thixotropic two-part silicone potting and encapsulating resin designed for the Indian market. It has been primarily developed for the protection of LED Drivers but its properties make it suited for a wide range of applications.

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GPA

General Purpose Epoxy Adhesive

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GPA

General Purpose Epoxy Adhesive

GPA is a two part, fast curing epoxy adhesive which was designed for general purpose bonding.

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ER6007

Repairable Epoxy Resin

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ER6007

Repairable Epoxy Resin

ER6007 is a two-part epoxy potting compound / encapsulating resin designed for the protection of electronic devices or components.

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ER6003

LED Driver Epoxy Resin

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ER6003

LED Driver Epoxy Resin

Electrolubes ER6003 epoxy potting compound has been specially developed for the LED Industry in India to protect the drivers from the varying environments found on the Indian subcontinent.

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ER6002LV

LED Epoxy Resin

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ER6002LV

LED Epoxy Resin

ER6002LV is a thermally conductive epoxy potting and encapsulation resin designed primarily for use in LED Driver units.

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ER6001

High Temperature Epoxy Adhesive

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ER6001

High Temperature Epoxy Adhesive

ER6001 is a two-part epoxy adhesive / encapsulation resin which has been developed for the Indian market primarily for the encapsulation of electrical components.

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